Overlay process control is a critical aspect of integrated circuit manufacturing. Advanced DRAM manufacturing overlay error budget approaches the sub-2nm threshold ...
Variation between different manufacturing equipment is becoming increasingly troublesome as chipmakers push to 10/7nm and beyond. Process variation is a well-known phenomenon at advanced nodes. But ...
Rapidus on Friday announced that it had begun prototyping of test wafers with 2nm gate-all-around (GAA) transistor structures at its IIM-1 facility in Japan. The company confirmed that early test ...
Concept of mask/wafer co-optimization by moving the shot with mask and wafer double simulation to minimize wafer error. VSB shot configurations and its corresponding ...
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Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--July 12, 2005--Applied Materials, Inc. today launched the industry's most advanced silicon etch technology, the Applied Centura(R) AdvantEdge(TM) system, ...
The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...
Semiconductor fabrication facilities risk substantial financial exposure from incoming wafers defects. With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, ...
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