Competition for top quants is at a fever pitch — and the potential for riches has never been greater. But some keys to ...

Abstract: In the microsystem package structure, there are a large number of silicon through holes (TSV), microbumps, substrates, and other structures. The size effect between different structures in ...

Material structure processing software based on ASE (Atomic Simulation Environment) providing automation capabilities for calculating various properties of materials. Additionally, it aims to run and ...

Abstract: With the increase of chip complexity, the design and production of substrates and chip tend to be "integrated", and ceramic substrates has been more and more widely used due to its ...