Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...

Unveiled at CES, the new Copilot Star platform is designed to take smart device interoperability to the next level.

Abstract: During operation, wind turbine systems are affected by external wind speed disturbances and the dynamic coupling of the system, which can lead to significant resonance phenomena within ...