Materials innovation drives next-gen AI chips, enabling performance, efficiency and scalability.

How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.

A review paper by scientists at Beijing Institute of Graphic Communication presented  a thorough review of the existing research landscape, encapsulating the notable progress in swiftly expanding ...

While retail investors pile into crowded trades like NVIDIA (NASDAQ: NVDA) or TSMC (NYSE: TSM), sophisticated capital is ...

An ancient, fundamental cooling technique gets a new, more-efficient implementation via an innovative fiber matrix.

Chiplets enable scalability but dramatically raise interconnect complexity and risk. Silicon-proven NoC technology is the key ...

BW reports from Las Vegas on why CES 2026 marked the moment silicon efficiency caught up with AI ambition—turning the hype ...

TSMC says it has begun volume production of chips on its latest 2 nm-class process, marking the start of a manufacturing ramp that will shape leading-edge capacity planning through 2026. The update ...

Engineers develop GaN semiconductors, liquid cooling systems and chiplet packaging to handle growing AI power demands in data ...

From labs to fabs: Weebit ReRAM promises faster, smaller, and more reliable memory, drawing big tech attention ...

Semiconductors are a foundational component of modern technology and have rapidly become one of the largest industries in ...

Intel's CEO says he expects 'great momentum in terms of yields and IP' on the company's 14A process technology.