Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...
Vikram Solar Ltd today announced the adoption of G12R format across its entire PV module portfolio. The company said the move ...
Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
Global energy demand is rising rapidly, driven by data centers, advanced vehicles, and new manufacturing technologies. Researchers at NREL have developed an ultra-efficient, compact power module that ...