Abstract: The main purpose of this study is to comprehensively analyze thermo-mechanical behavior according to various conditions and variables when HBM is mounted on SIP. Nowadays, HBM (High ...
Abstract: System-in-package (SiP) is an advanced packaging technology that integrates multiple chips and components into a single package, creating a highly integrated system. Integrated Passive ...
Fork this repo and update all contents including Readme.md and Package.json to create and release a new UPM-compatible Unity package. You can either use the Unity Package Manager Window (UPM) or ...
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