Taiwan has launched CoCoB, a substrate-less chip packaging platform targeting academic institutions and startups locked out ...

Paras Defence and Space Technologies Ltd. on Monday announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking its entry into the semiconductor segment with a focus on advanced ...

Paras Defence launched Paras Semiconductor to set up advanced heterogeneous & 3D chip packaging, strengthening India’s ...

Chemco Group, one of India’s leading plastic packaging manufacturers, has commissioned a state-of-the-art food-grade rPET ...

Konica Minolta will present digital production presses, label solutions, embellishment systems, and workflow automation at ...

TekniPlex Healthcare, which utilizes advanced materials science expertise to help deliver better patient outcomes, will showcase its latest innovations for the pharmaceutical ...

From AI to high-performance computing -- we take a look at emerging use cases and predictions in the industry AUSTIN, ...

TRS offers a robust solution for analyzing heterogeneous samples, providing comprehensive spectral data essential for ...

Abstract: As materials and fabrication processes advance, the medium voltage (MV) silicon carbide (SiC) power semiconductors featuring exceptional electrothermal properties are emerging in high-power ...

Four new paper and packaging satellites in China and India; doubled capacity at an additional site in India --- ...

BUFFALO GROVE, IL / ACCESS Newswire / January 12, 2026 / PPC Flex, a leading North American flexible packaging ...

Norton Packaging CEO Greg Norton and the Norton family have retained a significant interest in the business, and Norton will ...