TSMC's faces costs, politics, and capacity obstacles. Once framed as politically motivated, TSMC's US expansion has evolved into a costly long-term commitment exceeding US$165 bil ...

Abstract: Frame-based power electronics where silicone gels serve as potting materials inside the module are widely used in various applications, including renewable energy systems, energy storage ...

Review these critical steps for choosing microelectronics and learn how a manufacturer can help integrate them into your next ...

JIANGMEN, GUANGDONG, CHINA, January 14, 2026 /EINPresswire.com/ -- As smart home products increasingly transform ...

On 2nd January 2026, the Ministry of Electronics and Information Technology (MeitY) approved 22 fresh proposals under the Electronics Components Manufacturing Scheme (ECMS), attracting projected ...

Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the ...

The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...

South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

Schaeffler noted that several systems reflected the integration of software assets gained through its acquisition of Vitesco ...

SK Hynix announces a $12.9 billion investment in a new chip packaging facility in Cheongju to address global AI memory chip ...

Abstract: The stray inductance of the commutation circuit significantly impacts power semiconductor device switching. This article presents a comprehensive investigation on stray inductance extraction ...

PIC International returns to The Sheraton Airport Hotel, Brussels, Belgium, from 20–22th April 2026, as part of AngelTech.