The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...

Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the ...

PIC International returns to The Sheraton Airport Hotel, Brussels, Belgium, from 20–22th April 2026, as part of AngelTech.

Review these critical steps for choosing microelectronics and learn how a manufacturer can help integrate them into your next ...

South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

Schaeffler noted that several systems reflected the integration of software assets gained through its acquisition of Vitesco ...

The U.S. heterogeneous integration market is estimated at USD 0.47 billion in 2025E and is projected to grow at a CAGR of 22.99% from 2026 to 2033, reaching USD 2.47 billion. Growth is driven by ...

VCG . SK Hynix said on Tuesday that it has decided to invest 19 trillion won ($12.9 billion) to build an advanced chip ...

JIANGMEN, GUANGDONG, CHINA, January 14, 2026 /EINPresswire.com/ -- As smart home products increasingly transform ...

Penguin Solutions, Inc. a leading provider of high-performance computing and AI infrastructure solutions, today announced ...

At Voice & Data 5G+ Conference, leaders discuss Make in India, electronics manufacturing, value addition and self-reliant ...

Ratings for Amkor Tech (NASDAQ: AMKR) were provided by 7 analysts in the past three months, showcasing a mix of bullish and ...