New research from the WISE group (Wearable, Intelligent, Soft Electronics) at The University of Hong Kong (HKU-WISE) has ...

The WISE research group (Wearable, Intelligent, Soft Electronics) at The University of Hong Kong (HKU-WISE) have addressed a ...

Figure 1. Schematic of the strategy to develop soft, 3D transistors with hydrogel semiconductors. The WISE research group ...

Flexible, hydrogel-based transistors that can host living cells point to a new class of bio-integrated electronics, blurring ...

Engineers from MIT say that stacking circuit components on top of each other could be the answer to creating more ...

With advanced ion implantation, China hopes to strengthen domestic chip production and reduce dependence on overseas ...

A research team at Prof. Hua Wang’s Integrated Devices, Electronics, and Systems (IDEAS) Group has published a pioneering paper in “Nature Electronics” which demonstrates a new class of high ...

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

The EPC2366 40 V eGaN® FET sets new benchmarks in performance, efficiency, and power density for next-generation power ...

The semiconductor industry stands at one of its most pivotal moments. As AI drives explosive demand for computing power, chip ...

When classic 2D scaling dominated, the industry’s center of gravity was disinflationary: Chip average selling prices (ASPs) trended lower, and wafer fab equipment (WFE) growth was intermittent. In ...

The industry’s answer is gate-all-around (GAA). This design wraps the gate material completely around all sides, including ...