This strategic move integrates ASTER’s advanced "shift-left" design for test (DFT) functionality directly into Siemens' ...

Among such innovators leading this change, Automation Lead Mohnish Neelapu stands at the forefront of the movement to ...

How Naresh Kalimuthu bridges innovation and reliability by transforming defect management in modern software operations.” ...

Abstract: Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, ...

Abstract: This work elucidates the intricate interplay between the structural complexity of double absorber layered perovskite solar cells and the presence of defects, offering crucial insights for ...