The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
SAN JOSE, Calif., Feb. 23, 2011 /PRNewswire/ -- Novellus Systems announced today that its subsidiary Peter Wolters GmbH has introduced a new version of its microLine double side lapping system for ...
Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...
Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...
The kind of lapping plate Insaco uses plays a vital role in the lapping process. It significantly affects the output of this abrasive machining technique. A plate should not be too hard as it damages ...
The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...
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