Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

If you’re an operations leader, you’ve likely heard the promise of seamless technology integration. The refrain from technology vendors is familiar: “Our system is integratable with your tech stack!” ...

Modern businesses use various technology solutions, but not all of them are identical. Disparate applications do not interact with each other by default and require API integrations. These ...

It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

Since their invention in the middle of the 20th century, semiconductor integrated circuits have become the driving force behind the world's digital transformation thanks to Moore's Law, which improves ...

“This isn’t what I asked for” is a phrase that’s all too common when it comes to an end-state of operational technology (OT) deployments. In many situations, building owners and operators receive ...

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The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by ...