In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
SEOUL, Sept. 3 (Yonhap) -- Samsung Electro-Mechanics Co. and LG Innotek Co. on Wednesday showcased their latest package substrates for artificial intelligence, server and automotive sectors at a ...
The joint venture MOU is part of a strategy to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing (HPC).
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
TOKYO — Sanyo Electric Co. Ltd. has moved one step ahead in system-in-package technology with its Integrated System in Board (ISB) packaging approach. Sanyo's solution takes multiple ICs, transistors ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...
TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...
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