IBM is developing co-packaged optics (CPO) technology to replace conventional electrical interconnects in chips, which it says will speed up AI model training and increase energy efficiency for data ...
“The resulting growth of LLMs … is requiring exponential growth in high-speed connections between chips and data centers,” IBM Research engineer John Knickerbocker said. IBM Research has developed ...
Why co-packaged optics (CPO) are needed in high-performance computing (HPC). How IBM delivers CPO. What CPO means for HPC applications like artificial intelligence and machine learning. Providing high ...
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