Korean researchers have developed a new analysis method capable of detecting “hidden defects” in semiconductors with a ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...

In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

Solid rocket motors (SRMs), extensively used in aerospace and missile systems, employ CFRP composites in motor casings due to their superior mechanical properties. However, the bonding interface ...

Pipeline defect analysis and assessment remains a critical area of research, given its direct impact on the safety and reliability of energy transportation infrastructures. Mechanical defects such as ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

Electron diffraction is a powerful analytical technique used to study the atomic structure of materials. It involves the interaction of a beam of electrons with a crystalline sample, resulting in a ...

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...