Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...
Pipeline defect analysis and assessment remains a critical area of research, given its direct impact on the safety and reliability of energy transportation infrastructures. Mechanical defects such as ...
A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...
The Atomic Force Microscope (AFM) has evolved from an extremely high resolution scientific research instrument into a highly accurate metrology tool. This evolution has broadened the role of the AFM ...
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Detecting 'hidden defects' that degrade semiconductor performance with 1,000X higher sensitivity
Semiconductors are used in devices such as memory chips and solar cells, and within them may exist invisible defects that ...
At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
The Atomic Force Microscope (AFM) has evolved from an extremely high resolution scientific research instrument into a highly accurate metrology tool. This evolution has broadened the role of the AFM ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...
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