According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...
One of the caveats of TSMC's manufacturing in the U.S. is that all wafers processed at Fab 21 in Arizona are shipped back to Taiwan for dicing, testing, and packaging, which is why processors fabbed ...
AMSTERDAM (Reuters) -Customers of Chinese-owned Dutch chipmaker Nexperia are working with the company on a workaround to bypass a feud between the Europe-based unit and its packaging plant in China, ...
Apple is in talks with suppliers to manage iPhone chip assembly and packaging in India for the first time, reports The Economic Times. "Exploratory conversations" are said to have taken place with ...
Apple is reportedly in exploratory conversations with at least one partner to potentially handle iPhone chip assembly and packaging in India for the first time. Here are the details. According to The ...
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...
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