The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

Taiwan-based IC packager Advanced Semiconductor Engineering (ASE) has seen its BGA (ball-grid array) packaging orders plummet in the second quarter but is said to have received large orders for ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...

Fairchild Semiconductor International announced the FDZ299P, the industry's best solution when combining electrical and thermal performance with size. This new p-channel MOSFET's high-performance ...