BGAP520 PCIe NVMe, the latest addition to SMART Modular’s portfolio of DuraFlash products, delivers durable and reliable Flash solutions to the industrial embedded market segment. BGAP520 PCIe NVMe, ...
The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
TOKYO--(BUSINESS WIRE)--Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company announced it will showcase a reference display of the world’s first [1] PCI Express (PCIe) single ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
Mobile processors these days don't come with sockets like desktop CPUs, but they're still manufactured for a specific package type. The package for AMD's "Phoenix" and "Hawk Point" processors is ...
New BGAP520 PCIe NVMe product family addresses need for soldered-down and small module form factor Flash storage for industrial embedded market segments NEWARK, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) ...
NEWARK, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) -- SMART Modular Technologies , a subsidiary of SMART Global Holdings , Inc., (NASDAQ: SGH), and a leader in specialty memory, storage and hybrid ...
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