Multi-scale 3D CT imaging enables digital twinning, high-fidelity simulation of composite structures
Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...
A team of researchers has developed an innovative imaging platform that promises to improve our understanding of cellular structures at the nanoscale. This platform, called soTILT3D for ...
Improvements in three-dimensional (3D) scanning have enabled quick and accurate scanning of 3D objects, including cultural heritage objects, as 3D point cloud data. However, conventional ...
In a recent study published in the journal Nature Methods, a group of researchers developed a novel method called Ribonucleic Acid (RNA) High-Order Folding Prediction Plus (RhoFold+). This deep ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...
The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
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